| Capability | Specification |
|---|---|
| Assembly Technology | SMT, Through-Hole (THT), Mixed Technology, Box Build & System Integration |
| Minimum Component Size | 0201 components | BGA, QFN, LGA, CSP, fine-pitch packages |
| PCB Layers Supported | Single layer to 24-layer multilayer PCBs |
| PCB Board Size | 10mm × 10mm (min) to 500mm × 500mm (max) |
| Solder Process | Lead-free RoHS compliant and standard leaded — both available |
| Minimum Order Quantity | 1,000 boards per run (we specialise in bulk production) |
| Inspection & Testing | AOI, X-Ray, SPI, ICT, Functional Testing, IPC-A-610 Visual |
| Quality Certification | ISO 9001:2015 | IPC-A-610 Class 2 & 3 | RoHS | REACH |
| Conformal Coating | Acrylic, silicone, urethane coating available |
| Programming | MCU, Flash, FPGA, EEPROM in-circuit programming |
| Lead Time | 15–25 working days standard | Rush service available |
| Markets Served | Domestic India (pan-India) | International Export |
